We are seeking highly motivated PhD and Master’s graduates in Electrical Engineering, Electronics Engineering, Materials Science, Mechanical Engineering, Microsystems, Semiconductor Engineering, or related disciplines to join our advanced packaging and system integration team. The engineer will contribute to next-generation semiconductor packaging technologies, IC Packaging, System-in-Package (SiP) architectures, printed circuit board (PCB) design, PCB assembly (PCBA), reliability engineering, and high-performance electronic systems development.
Advanced IC Packaging
- Develop and optimize advanced semiconductor packaging technologies, including:
- Flip-Chip
- Wire Bond
- Ball Grid Array (BGA)
- Chip Scale Package (CSP)
- Wafer-Level Packaging (WLP)
- Fan-Out Packaging (FOWLP)
- 2.5D and 3D Packaging
- Design package structures, interconnects, substrates, and material stacks.
- Perform package characterization, qualification, and validation.
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System-in-Package (SiP) Development
- Architect and integrate multi-chip solutions consisting of:
- Processors
- Memory devices
- Analog ICs
- RF components
- Passive devices
- Sensors
- Optimize electrical, thermal, mechanical, and signal integrity performance.
- Support heterogeneous integration and miniaturized electronic systems.
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PCB & High-Speed Design
- Collaborate with PCB layout teams on:
- High-speed digital systems
- RF and wireless products
- Power electronics
- Mixed-signal designs
- Review stack-up design, routing, impedance control, grounding, and power distribution.
- Conduct signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC) analysis.
PCB Assembly (PCBA) Engineering
- Support SMT and through-hole assembly processes.
- Evaluate soldering, reflow, underfill, molding, and encapsulation processes.
- Resolve manufacturing yield and assembly challenges.
- Implement Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Test (DFT) practices.
